Capabilities include selectable point measurement on sample, microbeam x-ray spot size, 0 – 100 mm diameter area mapping of crystalline microstructure, texture analysis, residual stress analysis, phase identification, and microstructural analysis as a function of location (0, 1, and 2D mapping). System features include:
Linked CCD camera picture to measurement location
Small (300 micron) to large (15 mm) x-ray spot size
Small to large (up to 100 mm diameter) sample sizes
Sample positioning in 5 dimensions; x, y, z, φ (yaw), and χ (roll) with ± 5 micron accuracy
3 kW Cu Kα source of x-rays (1.5406 Å)
Enhanced signal to noise 0D scintillation detector
Low (fast) to high (slow) resolution optics
Software packages; residual stress, texture, phase identification, reciprocal space mapping, 0D to 2D area data visualization